High Power
Peak power over 25 dBm
- TSL-570 Type U
Ultra High Power
Tunable Laser
Tunable Laser to Address Optical Loss Challenges in AI-Driven CPO Architectures
- Ultra high output power +25 dBm
- Fast- up to 200 nm/s, wavelength sweeps
- Tuning range: 1270 - 1350 nm
- Wavelength resolution: 0.1 pm
- Fine tuning scan range: 10 GHz
Description
The TSL-570 Type U is a high-performance tunable laser delivering ultra-high optical output power exceeding 25 dBm. Engineered for Co-Packaged Optics (CPO) and advanced silicon photonics applications, this model provides significantly enhanced output to meet the demands of next-generation photonic systems.
The CPO and silicon photonics markets are experiencing rapid growth, driven by the expansion of AI-powered data centers and high-performance computing architectures. CPO systems require optical signal splitting across multiple waveguides, introducing substantial splitting, coupling, and waveguide losses. These challenges create a strong need for high-power, wavelength-tunable laser sources that enable accurate and repeatable device characterization.Through optimized cavity design and advanced control circuitry, the TSL-570 Type U achieves more than three times the optical output of previous TSL-570 models. With this breakthrough, the TSL-570 Type U is the ideal solution for CPO and silicon photonics evaluation—supporting a wide range of applications from R&D to high-volume manufacturing test environments.
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Wavelength Stability
State-of-the-art wavelength stability under temperature changes
Rapid Sweep Technology
Precise speed control up to 200 nm/s with high accuracy
Wavelength Resolution and Accuracy
0.1 pm resolution and sub-pm wavelength accuracy
Fine Tuning Scan Range
Scan range tuning as small as 10 GHz
Features & Characteristics
- Ultra high output power +25 dBm
- Fast, up to 200 nm/s, wavelength sweeps
- Tuning range: 1270 - 1350 nm
- Wavelength resolution: 0.1 pm
- Fine tuning scan range: 10 GHz
Typical Data
Wavelength vs. Power
Optical Spectrum
Applications
- Co-Packaged Optics
- Silicon Photonics testing
- Optical Component testing
- Optical spectroscopy
Please refer to this link for details. -> Swept Test System
Resources
Documentation
Contact UsTechnical Whitepaper: Everything You Need to Know About Silicon Photonics
Silicon photonics has become a foundational technology in high-speed data communication, integrated photonic circuits (PICs), and next-generation optical systems. This comprehensive whitepaper delivers an in-depth, engineer-friendly introduction to silicon photonics — exploring its physical principles, key device architectures, and measurement challenges.
In this whitepaper, you will discover:
1. The fundamentals of silicon photonics: waveguides, modulators, and photodetectors
2. Common silicon photonic device designs (e.g., ring resonators, Mach-Zehnder modulators)
3. Key performance metrics, such as insertion loss, extinction ratio, and modulation bandwidth
4. Measurement techniques and best practices for silicon photonic component testing
5. How tunable lasers, stable wavelength sources, and precision power meters can be integrated into a silicon photonics test setup
6. Practical system design tips to improve measurement accuracy and yield
This guide also explains how Santec’s tunable lasers, wavelength stabilization solutions (Laser Lock Pro), and high-performance optical power meters can support your silicon photonic device development and qualification workflow.
Read the full whitepaper
Technical Whitepaper: Co-Packaged Optics – Redefining Interconnects with Precision Testing
Co-packaged optics (CPO) is revolutionizing data center and high-performance computing interconnects by integrating optical engines directly with switching ASICs. This whitepaper offers a detailed, engineer-level exploration of CPO, covering both the technological benefits and the rigorous testing requirements needed to ensure performance and reliability.
In this whitepaper, you will discover:
1. The key drivers for CPO adoption — power efficiency, bandwidth scaling, signal integrity, and form-factor optimization
2. How photonic integrated circuits (PICs) enable compact, high-density optical I/O in CPO architectures
3. Thermal challenges in co-packaged designs and best practices for thermal management during testing
4. Testing strategies for CPO modules: measuring insertion loss, return loss, polarization effects, crosstalk, and more
5. Advanced measurement solutions: how Santec’s tunable lasers, polarization synthesizers, power meters, and swept analyzers (e.g., STS system, SPA-110) can be integrated into high-precision CPO validation setups
6. Practical tips for building an automated, repeatable test flow that addresses the unique trade-offs of co-packaged optics
Whether you're developing PICs for production, characterizing module-level performance, or optimizing test processes for yield and scale, this guide shows how Santec’s measurement instruments support every aspect of CPO development.
Read the full whitepaper
