超高功率可调谐激光器

TSL-570 Type U 可调谐激光器是一款高性能、超高功率型号，峰值光输出功率超过 +25 dBm。该超高功率可调谐激光器专为共封装光学（Co-Packaged Optics, CPO）及先进硅光子（Silicon Photonics）应用而设计，可提供显著增强的光输出能力。

随着 AI 驱动的数据中心与高性能计算（HPC）架构的快速发展，CPO 与硅光子市场正迎来强劲增长。

在 CPO 系统中，光信号需在多条波导间进行分光传输，系统本身不可避免地引入分光损耗、耦合损耗及波导损耗。这些挑战促使市场对高功率、波长可调、且具备高度重复性与稳定性的激光光源产生更高需求，以支持精确可靠的器件特性评估。

通过对激光腔体结构与控制电路的优化设计，Santec LIS 成功实现了相较以往 TSL-570 系列超过 3 倍的光输出提升。

凭借这一能力，TSL-570 Type U 成为 CPO 与硅光子评估的理想激光光源，全面支持从研发阶段到量产测试环境的多种应用场景。

• 超高输出功率：+25 dBm
• 高速: 高达200nm/s, 波长扫描速度
• 宽可调谐范围: 1270 - 1350 nm
• 波长分辨率: 0.1 pm
• 精细调节扫描范围: 10 GHz

• 共封装光学（CPO）
• 硅光子测试
• 光器件测试
• 光谱学

请参阅以下链接获取更多细节。-> Swept Test System

Silicon photonics has become a foundational technology in high-speed data communication, integrated photonic circuits (PICs), and next-generation optical systems. This comprehensive whitepaper delivers an in-depth, engineer-friendly introduction to silicon photonics — exploring its physical principles, key device architectures, and measurement challenges.

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Co-packaged optics (CPO) is revolutionizing data center and high-performance computing interconnects by integrating optical engines directly with switching ASICs. This whitepaper offers a detailed, engineer-level exploration of CPO, covering both the technological benefits and the rigorous testing requirements needed to ensure performance and reliability.

In this whitepaper, you will discover:

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Whether you're developing PICs for production, characterizing module-level performance, or optimizing test processes for yield and scale, this guide shows how Santec’s measurement instruments support every aspect of CPO development.
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